CNC High Precision Fused Quartz Parts For Semiconductor Wafer Equipment
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  • CNC High Precision Fused Quartz Parts For Semiconductor Wafer Equipment
  • CNC High Precision Fused Quartz Parts For Semiconductor Wafer Equipment
  • CNC High Precision Fused Quartz Parts For Semiconductor Wafer Equipment
CNC High Precision Fused Quartz Parts For Semiconductor Wafer Equipment CNC High Precision Fused Quartz Parts For Semiconductor Wafer Equipment CNC High Precision Fused Quartz Parts For Semiconductor Wafer Equipment

CNC High Precision Fused Quartz Parts For Semiconductor Wafer Equipment

  • Category: Quartz Parts
  • Material:High Purity Fused Quartz
  • Working temperature:1100℃
  • Diameter:Customer's design
  • Application:Semiconductor Wafer Equipment
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CNC High Precision Fused Quartz Parts For Semiconductor Wafer Equipment 

Quartz glass components and Fused Quartz Parts in wafer equipment (semiconductor wafer manufacturing equipment) have become core parts in several critical process stages due to their high purity, high-temperature resistance, corrosion resistance, low thermal expansion coefficient, and high light transmittance. These components must withstand the effects of etching gases and plasma, maintaining structural stability and chemical properties to ensure the precision and repeatability of the etching process.

Quartz Parts Characteristics:
1. Resistance high temperature.
2. Good chemical stability, acid-proof, alkali-proof.
3. Lower coefficient of thermal expansion.
4. High transmittance.


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